Key Features:
- Precision Manufacturing: Utilizes laser drilling and microvia technology for fine-pitched traces (as small as 0.05mm/2mil) and reliable interconnects.
- Superior Flexibility: Supports repeated bending and twisting with a minimum bend radius of 0.5mm, ideal for dynamic environments like wearables or automotive sensors.
- High-Density Interconnects (HDI): Enables complex circuitry in limited spaces, including multi-layer stacking and blind/buried vias for improved signal routing.
- Excellent Thermal & Electrical Performance: Enhanced heat dissipation and stable impedance control (-10% tolerance) for high-speed data transmission.
- Robust Durability: Resists moisture, chemicals, and temperature extremes (-40°C to 125°C), ensuring long-term reliability in harsh conditions.
Applications:
Perfect for wearable tech (smartwatches, fitness bands), medical devices (implantables, diagnostic tools), consumer electronics (ultra-thin smartphones, AR/VR headsets), automotive systems (dashboards, interior sensors), and IoT-enabled gadgets requiring compact, flexible designs.
Advantages Over Rigid PCBs:
- Space Savings: 0.1mm thickness reduces device size by up to 50% compared to traditional rigid boards.
- Cost Efficiency: Simplifies assembly processes and minimizes material waste.
- Design Freedom: Enables 3D conformal packaging for unconventional shapes.
Manufactured with IPC-6012 Class 2/3 standards, these FPCBs balance precision, flexibility, and affordability, making them a top choice for prototyping and mass production in cutting-edge electronics. Explore our custom solutions for your next miniaturized project!