Menu
| Layers | 2 |
| Board Thickness | 0.1MM |
| Material | Glue-free electrolysis |
| Copper Thickness | 1/3 OZ |
| Surface Treatment | Immersion nickel gold |
| Minimum Line Width/Line Spacing | 0.06/0.06 |
| PI Reinforcement Thickness | 0.2MM |
| Impedance | / |
| Features | BGA package + green oil process |
Vehicle-Mounted Double-Sided Flexible Printed Circuit Board (FPC) and flexible solution designed for automotive applications, where space constraints, durability, and complex connectivity demands are critical. Built on a 0.1–0.3mm thick polyimide (PI) substrate with dual copper layers, these FPCs enable high-density interconnects through microvias (as small as 0.05mm/2mil) and support dynamic bending (up to 10,000+ cycles) to fit into tight spaces within modern vehicles
