PCB & PCBA
Manufacturing Services

  1. Home
  2. /
  3. Products
  4. /
  5. FPC
  6. /
  7. Mobile phone booth Double...

Mobile phone booth Double Side FPCB

Layers 2
Board Thickness 0.1MM
Material A pair of 1/3 double-sided non-adhesive calendering
Copper Thickness 1/3 OZ
Surface Treatment Immersion copper plating Immersion nickel gold
Minimum Line Width/Line Spacing 0.1/0.1MM
PI Reinforcement Thickness 125UM
Impedance /

 

Mobile Phone Booth Double-Side FPCB refers to a robust, space-efficient flexible printed circuit board designed for integration into ​public mobile charging stations, outdoor telephony booths, and smart communication infrastructure. Built on a ​0.15–0.3mm thick polyimide (PI) substrate with dual copper layers, this FPCB enables high-density interconnects, mechanical flexibility, and long-term durability for demanding environments. Ideal for applications requiring compact designs, dynamic bending, and resistance to moisture, dust, and temperature fluctuations, it supports seamless power distribution, signal routing, and interface connectivity in mobile phone booths worldwide.

Key Features & Technical Specifications

  • Ultra-Flexibility & Durability:
    • Supports ​10,000+ bend cycles with a minimum bend radius of ​0.5mm, suitable for curved or foldable booth structures.
    • Built-in ​conformal coating and ​IP67/IP68 certification for waterproof, dustproof, and corrosion resistance.
  • High-Performance Connectivity:
    • Dual-layer design with ​microvias (0.05mm/2mil) enables complex routing for USB-C, HDMI, Ethernet, and wireless charging ports.
    • Controlled impedance (100Ω–1GHz) ensures stable signal integrity for 4G/5G antennas, Bluetooth, and IoT sensors.
  • Extreme Environment Compatibility:
    • Operates reliably in ​**-40°C to 125°C** ranges, critical for outdoor booths in urban, desert, or polar regions.
    • RoHS/REACH compliance and ​halogen-free materials meet global safety and environmental standards.
  • Space Optimization:
    • Slim ​0.15mm thickness reduces booth bulk by up to ​40% compared to rigid PCBs, enabling sleek, futuristic designs.
    • 3D conformal packaging allows integration into unconventional shapes (e.g., curved screens, rotating doors).
  • Manufacturing Excellence:
    • IPC-6012 Class 2/3 certification ensures precision in trace widths (as narrow as ​0.03mm/1mil) and soldering reliability.
    • Automated optical inspection (AOI) guarantees defect-free production for mass deployments.

Related products

Contact Us