Key Features & Technical Specifications
- Ultra-Slim Profile:
- 0.1mm thickness saves 30–50% in device volume compared to rigid PCBs, perfect for slim smartphones, foldable phones, or medical handheld devices.
- 0.03mm/1mil minimum trace width allows dense circuitry for multi-row keypad layouts (e.g., 4×4, 6×6) with minimal space占用.
- Superior Flexibility:
- Supports 10,000+ bend cycles (minimum bend radius: 0.3mm) for reliable performance in wearable keyboards, rotating dial devices, or flexible displays.
- Conformal coating adds IP67/IP68 waterproofing for resistance to sweat, moisture, and accidental drops.
- High-Speed Signal Integrity:
- Controlled impedance (100Ω–1GHz) ensures stable transmission for USB-C, Bluetooth, or proprietary keyboard signals.
- Microvias (0.05mm/2mil) enable blind/buried interconnects for compact multi-layer designs without increasing board thickness.
- Extreme Temperature & Durability:
- Operates in **-40°C to 125°C** environments, critical for industrial keyboards or outdoor IoT devices.
- RoHS/REACH compliance and halogen-free materials meet global safety and sustainability standards.
- Manufacturing Precision:
- Laser Drilling ensures clean, precise via holes for fine-pitched components.
- IPC-6012 Class 2 certification guarantees trace alignment and solderability for mass production.