Key Features & Technical Specifications
- Ultra-Thin & Lightweight Design:
- 0.1mm thickness reduces module bulk by up to 40% compared to rigid PCBs, ideal for slim TV bezels, foldable displays, or wearable devices
- Dual copper layers allow for high-density routing (as fine as 0.03mm/1mil) to support multiple interfaces (HDMI, USB-C, Ethernet) and high-resolution displays.
- Flexibility & Durability:
- Supports 10,000+ bend cycles with a minimum bend radius of 0.5mm, suitable for curved or dynamic screen designs in AR/VR helmets, foldable smartphones, or automotive infotainment systems.
- Built-in conformal coating and IP67/IP68 certification ensure resistance to moisture, dust, and temperature extremes (-40°C to 125°C).
- High-Performance Connectivity:
- Controlled impedance (100Ω–1GHz) ensures stable signal transmission for 4K/8K video, high-speed data interfaces, and EMI shielding in crowded electronic environments.
- Microvias (0.05mm/2mil) enable blind/buried vias for compact multi-layer layouts without increasing board thickness.
- Thermal & Power Management:
- Optimized heat dissipation design for high-brightness LED/LCD modules, reducing thermal stress in compact enclosures.
- Supports wireless charging integration and IoT sensor connectivity for smart displays.