Key Features & Technical Specifications
- Ultra-Thin & Flexible Design:
- 0.1mm thickness reduces device bulk by up to 50% compared to rigid PCBs, perfect for ultra-slim mobile devices or wrap-around touchscreens.
- Supports 10,000+ bend cycles (minimum bend radius: 0.3mm) for reliable performance in foldable phones, AR/VR visors, or rotating touch panels.
- High-Density Interconnects:
- Dual-layer routing with 0.03mm/1mil trace width enables multi-touch (3D/5D) sensors, gesture recognition, and high-resolution display interfaces.
- Microvias (0.05mm/2mil) and blind/buried vias allow compact multi-layer designs for advanced touchscreens.
- Signal Integrity & Performance:
- Controlled impedance (100Ω–1GHz) ensures stable transmission for touch signals, USB-C, Bluetooth, and display data.
- EMI shielding and low crosstalk design improve signal clarity in noisy environments.
- Durability & Environmental Resistance:
- IP67/IP68 certification resists water, dust, and sweat, critical for wearable devices or outdoor kiosks.
- Operates reliably in **-40°C to 125°C** ranges, suitable for industrial, automotive, or extreme-condition use cases.
- Advanced Manufacturing:
- laser drilling and automated optical inspection (AOI) ensure precision in trace alignment and defect-free production.
- RoHS/REACH compliance and halogen-free materials meet global safety and sustainability standards