Key Features & Technical Specifications
- Ultra-Thin & Flexible Design:
- 0.1mm thickness reduces device bulk by up to 40% compared to rigid PCBs, ideal for slim wireless speakers, earbuds, or automotive headrest speakers.
- Supports 10,000+ bend cycles (minimum bend radius: 0.5mm) for dynamic designs in foldable speakers, wearable audio devices, or curved automotive panels.
- High-Density Interconnects:
- Dual-layer routing with 0.03mm/1mil minimum trace width enables multi-channel audio processing (e.g., stereo, 5.1-channel surround sound).
- Microvias (0.05mm/2mil) andblind/buried vias allow compact layouts for high-power amplifiers, MEMS microphones, or wireless charging coils.
- Signal Integrity & Audio Quality:
- Controlled impedance (100Ω–1GHz) ensures minimal signal loss for high-fidelity audio transmission (e.g., Hi-Res certification).
- EMI shielding and crosstalk suppression eliminate noise interference in Bluetooth speakers or public address systems.
- Power Efficiency & Thermal Management:
- Optimized heat dissipation for high-power Class D amplifiers, reducing thermal throttling in portable speakers.
- Voltage tolerance up to 24V supports automotive or industrial-grade audio systems.
- Durability & Environmental Resistance:
- Conformal coating and IP67/IP68 certification protect against moisture, dust, and temperature extremes (-40°C to 125°C).
- RoHS/REACH compliance and halogen-free materials ensure eco-friendly production and global market access.
- Advanced Manufacturing:
- laser drilling and AOI (Automated Optical Inspection) guarantee precision in via alignment and defect-free production.
- IPC-6012 Class 2/3 certification ensures trace width accuracy (±2μm) and solderability for mass production.