Key Features & Technical Specifications
- Ultra-Thin & Flexible Design:
- 0.1mm thickness reduces lamp bulk by up to 40% compared to rigid PCBs, ideal for slim LED strips, wearable devices, or automotive dashboard lighting
- Supports 10,000+ bend cycles with IP67/IP68 certification, ensuring durability in harsh environments
- 0.1mm thickness reduces lamp bulk by up to 40% compared to rigid PCBs, ideal for slim LED strips, wearable devices, or automotive dashboard lighting
- High-Density Interconnects:
- Single-layer routing with 0.03mm/1mil trace width allows precise design of microstrip or LED driver circuits for 24V–48V high-power applications
- blind/buried vias enable compact layouts for integrated components like thermal sensors or power modules
- Single-layer routing with 0.03mm/1mil trace width allows precise design of microstrip or LED driver circuits for 24V–48V high-power applications
- Thermal Management & Efficiency:
- Aluminum substrate (with thermal conductivity up to 2.0 W/m·K) efficiently dissipates heat from high-power LEDs, reducing thermal throttling and extending lifespan
- Phase change materials (PCMs) and conformal coating protect against moisture and extreme temperatures (-40°C to 125°C)
- Aluminum substrate (with thermal conductivity up to 2.0 W/m·K) efficiently dissipates heat from high-power LEDs, reducing thermal throttling and extending lifespan
- Manufacturing & Cost Efficiency:
- Automated optical inspection (AOI) and laser drilling ensure precision in via alignment and defect-free production
- Simplifies assembly with surface-mount technology (SMT), reducing material waste by 40% vs. traditional wire harnesses
- Automated optical inspection (AOI) and laser drilling ensure precision in via alignment and defect-free production