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Multilayers Flex PCB

Layers 4
Board Thickness 0.25MM
Material Glue-free electrolysis
Copper Thickness 1/3 OZ
Surface Treatment Immersion nickel gold
Minimum Line Width/Line Spacing 0.05/0.05MM
PI Reinforcement Thickness 0.2MM SUS304
Impedance 100 ohm differential impedance
Features /

 

​ Built on ​polyimide (PI) or aluminum substrates with ​0.1–0.3mm thickness, this FPCB combines the ​flexibility of single-layer designs with the ​capacity of multi-layer routing to optimize space, performance, and reliability in consumer electronics, aerospace, and medical devices

Applications

  1. Consumer Electronics:
    • Foldable smartphones, smartwatches, and compact cameras with embedded sensors
  2. Aerospace & Automotive:
    • Aircraft avionics, satellite systems, and electric vehicle battery management modules
  3. Medical Devices:
    • Implantable devices (e.g., pacemakers) and portable diagnostic equipment requiring biocompatible, high-reliability circuits

Market Dominance & Advantages

  • Industry Standard:
    • The ​multi-layer segment accounts for over ​50% of the global PCB market, driven by demand for compact, high-performance electronics
  • Cost & Efficiency:
    • Reduces material waste by ​40% vs. rigid PCBs and simplifies assembly with ​surface-mount technology (SMT)

By emphasizing ​miniaturization, ​signal efficiency, and ​mechanical durability, this optimized content attracts ​electronics OEMs, aerospace suppliers, and medical device developers seeking innovative, reliable FPCB solutions for next-gen technology.

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