With the continuous development of electronic technology, circular PCB boards are becoming increasingly common in industrial production. Proper copper-clad operation of circular PCB boards is crucial for ensuring the performance and reliability of the circuit board.
一、 Preparation work
Before performing copper plating on a circular PCB board, it is necessary to prepare the necessary tools and materials. Tools include: PCB board, copper foil, fixture, scraper, cleaning agent, etc. In addition to copper foil, materials also include photosensitive adhesive, copper-clad adhesive, etc. When selecting materials, the appropriate thickness and quality should be chosen according to actual needs.
二、 Copper film application
1.The copper foil on the PCB board must have sufficient adhesion to the substrate surface. Therefore, before applying copper film, the surface of the PCB board should be polished to remove oxide layers and foreign objects.
2. Apply photosensitive adhesive evenly on the PCB board and use the pre made fixture to stick the copper foil onto the photosensitive adhesive.
3. Exposure processing. Place the copper-clad PCB board under a UV lamp and fully expose it according to the exposure time requirements of the photosensitive adhesive used.
4. Board washing treatment. Soak the exposed PCB board in a photosensitive adhesive developer solution until the colloidal pattern is clearly visible. Then, use a cleaning agent to thoroughly clean the remaining photosensitive adhesive.
三、 Acid washing treatment
1. Remove the photosensitive adhesive. Soak the pickled PCB board in a solution that removes the photosensitive adhesive for a period of time. After the adhesive is completely dissolved, remove it and use a cleaning agent for cleaning.
2. Perform acid washing. Place the PCB board that has removed the photosensitive adhesive into an acid pickling tank to ensure sufficient contact with the acid solution. During the pickling process, it is important to control the concentration and temperature of the pickling solution to avoid issues of excessive corrosion and insufficient pickling.
3. Wash and treat. Rinse the pickled PCB board thoroughly in clean water to ensure complete removal of acid. Then use deionized water for final rinsing.
四、 Precautions
1. During the entire copper plating process, pay attention to keeping the operating environment clean and tidy to avoid dust and impurity pollution.
2.When using a scraper to scrape off excess copper foil, pay attention to the control of force and angle to prevent scratching the PCB board.
3. When carrying out acid washing and cleaning steps, safety precautions should be taken to avoid acid splashing into the skin or eyes.
By following the above steps, you can correctly perform the copper plating operation on the circular PCB board. In the actual operation process, it is recommended that you make specific adjustments based on the materials and equipment used. At the same time, strict quality inspection is carried out in each operation step according to the actual situation to ensure the accuracy and reliability of the operation.